3D Bioplotter Research Papers

Displaying all papers about Silica (2 results)

Shape memory epoxy composites with high mechanical performance manufactured by multi-material direct ink writing

Composites Part A: Applied Science and Manufacturing 2020 Volume 135, Article 105903

Using 3D printing to manufacture shape memory polymers (SMPs) becomes popular, since the technique endows SMPs the ability to shape into desired structures according to their applications. Among various types of SMPs, epoxy-based shape memory polymer and their composites are known for their high modulus and strength. However, limited by their rheological behavior, it is still hard to prepare high-quality printable epoxy materials. Here, by carefully tuning of rheological properties, we can prepare printable ink showing good shape retention, excellent mechanical performances below and above the glass transition temperature of epoxy, as well as good shape memory effect. The prepared…

High thermal conductive epoxy based composites fabricated by multi-material direct ink writing

Composites Part A: Applied Science and Manufacturing 2020 Volume 129, Article 105684

Thermal management is of importance to microelectronic industry. Owing to both excellent thermal conduction and electrical insulation, hexagonal boron nitride (BN) platelets are the widely-used thermal conductive fillers in polymers. Adding high content of BN can endow polymers high thermal conductivity, but in most cases, destroy the flexibility, failure strength as well as processability of the polymers significantly. Here, we report a multi-material 3D printing technique to prepare high thermal conductive epoxy based composites, by which BN platelets were assembled together in heat-conducting phase to form the dense, continuous thermal pathway. The BN platelets show excellent alignment along printing direction…